Items where Author is "Bailey, C."

Article

Chen, H., Yu, W., Cargill, S., Patel, M.K., Bailey, C., Tonry, C. and Desmulliez, M.P.Y. (2012) Self-encapsulated hollow microstructures formed by electric field-assisted capillarity. Microfluidics and Nanofluidics, 13 (1). pp. 75-82. ISSN 1613-4982 (Print), 1613-4990 (Online) (doi:10.1007/s10404-012-0942-6)

Rosunally, Y.Z., Stoyanov, S., Bailey, C., Mason, P., Campbell, S., Monger, G. and Bell, I. (2011) Fusion approach for prognostics framework of heritage structure. IEEE Transactions on Reliability, 60 (1):570453. pp. 3-13. ISSN 0018-9529 (doi:10.1109/TR.2011.2104451)

Rizvi, M.J., Bailey, C. and Lu, H. (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

Stoyanov, S., Bailey, C., Tang, Y.K., Marson, S., Dyer, A., Allen, D. and Desmulliez, M. (2010) Computational modelling and optimisation of the fabrication of nano-structures using focused ion beam and imprint forming technologies. Journal of Physics: Conference Series (JPCS), 253 (1):012008. ISSN 1742-6588 (Print), 1742-6596 (Online) (doi:10.1088/1742-6596/252/1/012008)

Bailey, C. and Lu, Hua (2009) Nanopackaging simulation: properties and behavior of packaging materials. Nanotechnology Magazine, 3 (2). pp. 34-37. ISSN 1932-4510 (doi:10.1109/MNANO.2009.932413)

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2008) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

Dhinsa, K., Bailey, C. and Pericleous, K. (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. Components and Packaging Technologies, IEEE Transactions on , 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

Slone, A.K., Pericleous, K., Bailey, C., Cross, M. and Bennett, C. (2004) A finite volume unstructured mesh approach to dynamic fluid–structure interaction: an assessment of the challenge of predicting the onset of flutter. Applied Mathematical Modelling, 28 (2). pp. 211-239. ISSN 0307-904X (doi:10.1016/S0307-904X(03)00142-2)

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2004) A cell-centred finite volume method for modelling viscoelastic flow. Journal of Non-Newtonian Fluid Mechanics, 117 (1). pp. 47-61. ISSN 0377-0257 (doi:10.1016/j.jnnfm.2003.12.001)

Bailey, C., Warner, M., Agha, A., Pericleous, K., Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385 (doi:10.1049/ccej:20020306)

Slone, A.K., Pericleous, K., Bailey, C. and Cross, M. (2002) Dynamic fluid–structure interaction using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:10.1016/S0045-7949(01)00177-8)

Book Section

Alam, M.O. and Bailey, C. (2011) Introduction to adhesives joining technology for electronics. In: Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Bailey, C. (2011) Modelling techniques used to assess conductive adhesive properties. In: Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. In: CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

Edited Book

Alam, M.O. and Bailey, C. (Eds.) (2011) Advanced adhesives in electronics, materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767

Conference Proceedings

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184428)

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

Sutharssan, T., Stoyanov, S., Bailey, C. and Rosunally, Y. (2012) Data analysis techniques for real-time prognostics and health management of semiconductor devices. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4673-0694-2 (print)

Lu, Hua and Bailey, C. (2011) Optimisation of heatsink design for a ruggedised LCD display. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 492-496. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:10.1109/ICEPT.2011.6066883)

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

Costello, S., Strusevich, N., Patel, M.K., Bailey, C., Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua, Mannan, S.H., Chan, Y.C. and Bailey, C. (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:10.1109/ICEPT.2011.6066874)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T., Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)

Rizvi, M.J., Lu, H., Bailey, C., Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz , R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on Advanced Packaging Materials . IEEE Xplore Digital Library, Piscataway, NJ, USA, pp. 98-101. ISBN 978-1-4244-6756-3 (doi:10.1109/ISAPM.2010.5441377)

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129

Musallam, M., Johnson, C.M., Yin, Chunyan, Lu, Hua and Bailey, C. (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

Yek, Bing Lee, Strusevich, N., Bailey, C., Chun-Yan, Yin and Cartwright, C. (2009) Packaging of light emitting diodes for display backlights: Need for multi-disciplinary design tools. In: Electronic Packaging Technology & High Density Packaging, 2009. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 205-208. ISBN 978-1-4244-4659-9 (online), 978-1-4244-4658-2 (print) (doi:10.1109/ICEPT.2009.5270764)

Lu, Hua and Bailey, C. (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:10.1109/ICEPT.2009.5270749)

Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)

Mallik, A., Stoyanov, S., Bailey, C. and Firth, P. (2009) Design for reliability methodology for micro laser welding of pigtail fibres. In: Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 978-1-4244-4161-7 (electronic), 978-1-4244-4160-0 (print) (doi:10.1109/ESIME.2009.4938409)

Lee, Yek Bing, Strusevich, N., Yan-Yin, Chun and Bailey, C. (2009) Analysis tools for thermal characterization, performance and reliability of rugged electronic displays. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-5. ISBN 978-1-4244-4260-7 (doi:10.1109/ISSE.2009.5206926)

Tang, Ying Kit, Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

Tang, Y.K., Stoyanov, S., Bailey, C. and Chan, Y.C. (2008) Optimisation methodology for risk mitigation in advanced micro-system electronics manufacturing. In: EngOpt 2008 - International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7

Tilford, T., Parrott, A.K., Bailey, C. and Pericleous, K.A. (2008) Multiphysics simulation of microwave processing using a multidomain coupled solver approach. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008). International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

Stoyanov, S., Mason, P. and Bailey, C. (2006) Computational methodology for analysis of historic composite structures. In: Proceedings of the 5th International Conference on Engineering Computational Technology. Civil-Comp Press, Stirlingshire, UK. ISBN 1905088116 ISSN 1759-3433 (doi:10.4203/ccp.84.132)

Dhinsa, K., Bailey, C. and Pericleous, K. (2005) Turbulence modelling for electronic cooling: A review. In: International Symposium on Electronics Materials and Packaging, EMPAS 2005. Institute of Electrical and Electronics Engineers Inc, Piscataway, USA, pp. 275-281. ISBN 1-4244-0107-0

Conference or Workshop Item

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)