Yin, C.Y. ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

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Abstract

This paper reports the investigations into the moisture induced failures in Flip-Chip-on-Flex interconnections using Anisotropic Conductive Films (ACFs). Both experimental and modelling methods were applied. In the experiments, the joint resistance was used as a quality indicator and was measured continuously during the autoclave test. The test condition was set as 121˚C, 100%RH and 2 atm. The results showed that the joint resistance of the ACF flip chip increased during the tests and nearly 25% of the joints were found open after 168 h’ testing. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. In order to have a better understanding of the experimental results, 3D Finite Element (FE) models of the ACF assembly were constructed and a macro–micro modelling technique was used to overcome the difficulty caused by the multi-length scale in the ACF assembly. The moisture diffusion and moisture-induced stresses in the ACF flip chip during the autoclave test were predicted. Modelling results are consistent with the findings in the experimental work.

Item Type:	Article
Additional Information:	[1] Published in print: July 2013. [2] Published as: Microelectronic Engineering, (2013), Vol. 107, pp. 17–22.
Uncontrolled Keywords:	anisotropic conductive film (ACF), moisture absorption, flip chip on flex
Subjects:	Q Science > Q Science (General)
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/9964

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