Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and ChaN, Y.C. (2005) Macro-Micro Modelling Analysis for High Density Packaged Flip Chips. In: Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005. IEEE, pp. 1-4. ISBN 0780392922 (doi:https://doi.org/10.1109/HDP.2005.251383)

Full text not available from this repository.

Abstract

A wide range of flip chip technologies with solder or adhesives have become dominant solutions for high density packaging applications due to the excellent electrical performance, high I/O density and good thermal performance. This paper discusses the use of modeling technique to predict the reliability of high density packaged flip chips in the humid environment. Reliability assessment is discussed for flip chip package at ultra-fine pitch with anisotropic conductive film (ACF). The purpose of this modeling work is to understand the role that moisture plays in the failure of ACF flip chips. A macro-micro 3D finite element modeling technique was used in order to make the multi-length-scale modeling of the ACF flip chip possible. Modeling results are consistent with the findings in the experimental work

Item Type:	Conference Proceedings
Title of Proceedings:	Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2005
Additional Information:	Originally presented at the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP2005), June 27-30, 2005, Shanghai, China.
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/921

Actions (login required)

View Item