Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684355)

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Abstract

The environmental and operating conditions applied to power electronic modules, such as temperature changes, load cycling, vibration, etc., cause degradation and ultimately failure in particular at interfaces between dissimilar materials, such as wire bonds and in solder layers. In this paper a compact real-time thermal model is used to predict the temperatures of the active device junctions and inaccessible locations such as solder layers within the power module. The temperature estimates are combined with lifetime based reliability models to provide a tool for life consumption monitoring. A rainflow counting method is applied to the temperature vs. time data to extract the occurrence frequencies of different thermal cycling ranges. Knowledge of the life consumed for each different cycle then allows the remaining life time to be estimated under arbitrary operational conditions through application of the Palmgren-Miner accumulated damage rule. Example results for life consumption in power module substrate solder layers are presented.

Item Type:	Conference Proceedings
Title of Proceedings:	2nd Electronics System Integration Technology Conference, Greenwich, UK
Additional Information:	[1] This paper was presented at the 2nd Electronics System-Integration Technology Conference 2008 (ESTC 2008 2nd), held from 1-4 September 2008 at the University of Greenwich, UK. [2] This work is funded by EPSRC through the Innovative Electronics Manufacturing Research Center (IeMRC)(UK). [3] INSPEC Accession Number: 10397473. [4] The Proceedings were originally published in two volumes.
Uncontrolled Keywords:	data mining, frequency, life estimation, lLifetime estimation, multichip modules, power electronics, predictive models, temperature, thermal degradation, wire
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences
Related URLs:	Publisher Organisation
Last Modified:	05 Nov 2019 12:12
URI:	http://gala.gre.ac.uk/id/eprint/9138

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