Desmulliez, M.P.Y., Kay, R.W., Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2004) Stencil printing at sub-100 microns pitch. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 354-358. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396633)

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Abstract

This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)
Additional Information:	[1] This paper was first presented at the 6th Electronics Packaging Technology Conference (EPTC 2004) held from 8-10 December 2004 in Singapore. [2] ISBN:0-7803-8821-6 (bound ed.); ISBN 0-7803-8822-4 (CD-ROM edition).
Uncontrolled Keywords:	adhesive bonding, chip scale packaging, conducting materials, fine-pitch technology, integrated circuit interconnections, printing, solders
Subjects:	Q Science > QA Mathematics > QA76 Computer software T Technology > TP Chemical technology
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:31
URI:	http://gala.gre.ac.uk/id/eprint/839

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