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Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages

Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages

Stoyanov, S. ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Cross, M. (2001) Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages. In: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]. The Mineral, Metals and Materials Society (TMS), Warrendale, PA, USA, pp. 551-562. ISBN 0873395131

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Item Type: Conference Proceedings
Title of Proceedings: Computational Modeling of Materials, Minerals and Metals Processing [Conference Proceedings]
Additional Information: [1] This paper was first presented at the Conference on Computational Modeling of Materials, Minerals and Metals Processing held from 23-26 September 2001 in San Diego, California, USA. It was given within the Optimization and Novel Methods section.
Uncontrolled Keywords: computational mechanics, numerical optimization material properties, electronic packages
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TN Mining engineering. Metallurgy
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 13 Mar 2019 11:31
URI: http://gala.gre.ac.uk/id/eprint/789

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