Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879 , Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

Full text not available from this repository.

Item Type:	Conference or Conference Paper (Paper)
Additional Information:	[1] This paper was first presented at IMAPS - Europe Cracow 2002, European Microelectronics Packaging and Interconnection Symposium and Table Top Exhibition, held from 16-18 June 2002 in Crakow, Poland. It was delivered within Session 7: Assembly Technologies (Part II) on 18 June 2002.
Uncontrolled Keywords:	multi-scale computational simulations, adhesive flows
Subjects:	Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Organisation
Last Modified:	13 Mar 2019 11:31
URI:	http://gala.gre.ac.uk/id/eprint/788

Actions (login required)

View Item