Gwyer, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

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Abstract

For sensitive optoelectronic components, traditional soldering techniques cannot be used because of their inherent sensitivity to thermal stresses. One such component is the Optoelectronic Butterfly Package which houses a laser diode chip aligned to a fibre-optic cable. Even sub-micron misalignment of the fibre optic and laser diode chip can significantly reduce the performance of the device. The high cost of each unit requires that the number of damaged components, via the laser soldering process, are kept to a minimum. Mathematical modelling is undertaken to better understand the laser soldering process and to optimize operational parameters such as solder paste volume, copper pad dimensions, laser solder times for each joint, laser intensity and absorption coefficient. Validation of the model against experimental data will be completed, and will lead to an optimization of the assembly process, through an iterative modelling cycle. This will ultimately reduce costs, improve the process development time and increase consistency in the laser soldering process.

Item Type:	Conference Proceedings
Title of Proceedings:	ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]
Additional Information:	[1] This paper was first presented at the Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2002 (ITHERM 2002) held from 30 May-June 2002 in San Diego, California, USA. [2] ISBN: 0780371526 (pbk); 0-7803-7153-4 (microfiche)
Uncontrolled Keywords:	laser beam welding, semiconductor device packaging, semiconductor lasers, semiconductor process modelling, soldering, modelling, thermal, laser
Subjects:	Q Science > QA Mathematics Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:31
URI:	http://gala.gre.ac.uk/id/eprint/783

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