Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

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Abstract

Recently, research has been carried out to test a novel bumping method which omits the under bump metallurgy (UBM) forming process by bonding copper columns directly onto the Al pads of the silicon dies. This bumping method could be adopted to simplify the flip chip assembly process, increase the productivity and achieve a higher I/O count. Computer modelling methods are used to predict the shape of solder joints and response of the flip chip to thermal cyclic loading. The accumulated plastic strain energy at the comer solder joints is used as the damage indicator. Models with a range of design parameters have been compared for their reliability. The ranking of the relative importance of these parameters is given. Results from these analyses are being used by our industrial and academic partners to identify optimal design conditions.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002)
Additional Information:	[1] This paper was first presented at the 4th Electronics Packaging Technology Conference (EPTC 2002) held from 10-12 December 2002 in Singapore. [2] ISBN: 0780374355 (Print); 0780376870 (CD-ROM)
Uncontrolled Keywords:	assembling, circuit reliability, copper, flip-chip devices printed circuit manufacture, reflow soldering, sensitivity analysis
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/782

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