Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562 (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

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Abstract

Heterogeneous electronics based systems are driven by an increasing demand for smaller form factor, faster and higher-density interconnection, and miniaturisation all at a cheaper cost. 3D packaging, using through-silicon-via technology, is positioned to satisfy these requirements and Carbon Nanotubes as an interconnection technology is gaining extensive interest in the community. This paper provides a summary of the latest advances in such technology, and discusses the challenges that need to be addressed by the community in terms of modeling technologies.

Item Type:	Conference Proceedings
Title of Proceedings:	2011 34th International Spring Seminar on Electronics Technology (ISSE)
Additional Information:	[1] In proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), held 11-15 May 2011, Tratanska Lomnica
Uncontrolled Keywords:	heterogeneous electronics based systems, higher-density interconnection, miniaturisation, silicon, carbon-nanotubes, interconnection technology
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Computer Systems Technology
Related URLs:	Publisher
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/7354

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