Gwyer, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

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Item Type:	Conference Proceedings
Title of Proceedings:	Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003
Additional Information:	[1] This paper was first presented at the IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2003) held from 30 March - 2 April 2003 in Aix en Provence, France. It was given on 31 March 2003 in Session 4: Thermal Behavior Modeling. [2] ISBN: 0780370546 (Print); 0780370562 (CD)
Uncontrolled Keywords:	computer modelling, optoelectronic packages
Subjects:	Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/680

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