Edussuriya, S.S., Williams, A.J. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Full text not available from this repository.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings of the 6th European Conference of Rheology, (eurheo 2002)
Additional Information:	[1] This paper was first presented at the 6th European Conference of Rheology, (eurheo 2002), held from 1-6 September 2002 in Erlangen, Germany.
Uncontrolled Keywords:	computational fluid dynamics, CFD, flip-chip packaging, Oldroyd-B
Subjects:	Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Organisation
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/563

Actions (login required)

View Item