Shishido, Nobuyuki, Kanno, Toshifumi, Kawahara, Shinya, Ikeda, Toru, Miyazaki, Noriyuki, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Thomas, Owen, Di Maio, Davide and Hunt, Chris (2010) An analysis of local deformation of SnAgCu solder joint using digital image correlation. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Association for Computing Machinery, New York, pp. 376-381. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582845)

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Abstract

The changeover from eutectic Sn-Pb solders to lead-free solders has been driven by environmental concerns and market accessibility in the last few years. Though a number of creep constitutive laws of lead-free solder have been reported due to the importance of creep in solder joint failure in the electronic packaging, these constitutive laws often show great variations across the applicable stress range. In-situ measurement of strain fields in micro regions can help make the creep model more realistic. In this study, shear tests have been carried out on small solder joints in order to gain insight into the factors affecting solder properties. In order to measure the strain in solder joints, the Digital Image Correlation Method (DICM) has been used. The experimental results proved that there are two mechanisms that disturb the uniform deformation in solder joint. One is the interfacial strain concentration which has a dimension of less than 30μm and the other is spreading across interfaces from the locally deformed area, which has a size from about 50μm to 100μm. The existence of these local concentrations of creep strain is thought to be at least one of the causes of the variations in the published creep parameters. The deformation of solder joint on the shear test has also been modeled using Finite Element Method (FEM), and a three-layered model has been proposed to simulate the experimental results.

Item Type:	Conference Proceedings
Title of Proceedings:	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Additional Information:	This paper forms part of the published proceedings from 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 August 16, 2010 - August 19, 2010 Xi'an, China
Uncontrolled Keywords:	solder joint failure, electronic packaging, strain on solder joints
Subjects:	Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/4460

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