Hua, Lu, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:https://doi.org/10.1109/ICEPT.2018.8480746)

Preview

PDF (Publisher VoR) 36758_RAJAGURU_A_numerical_procedure.pdf - Published Version Download (3MB) | Preview

Abstract

A numerical solution procedure for optimizing the thermal-mechanical reliability of an IGBT module has been described in this paper. The procedure is robust and it can handle both discrete and continuous decision variables in the design of IGBT packaging. An example has been given to demonstrate its application. The objective functions in this example are the accumulated plastic work density in solder joints of a simplified IGBT module that is subject to cyclic temperature cycling and the maximum junction temperature when the model is subject to a constant thermal loading. The thickness of the chip mount-down solder, thickness of the substrate solder joint, and the location of the chip are used as continuous decision variables. The material selection for the baseplate is treated as a discrete variable. The objective function values are calculated using Finite Element Analysis method.

Item Type:	Conference Proceedings
Title of Proceedings:	2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China
Additional Information:	Authorized licensed use limited to: University of Greenwich. Downloaded on June 21,2022 at 13:42:23 UTC from IEEE Xplore. Restrictions apply.
Uncontrolled Keywords:	power electronic module
Subjects:	Q Science > QA Mathematics Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) Faculty of Liberal Arts & Sciences
Related URLs:	Publisher
Last Modified:	23 Jun 2022 13:54
URI:	http://gala.gre.ac.uk/id/eprint/36758

Actions (login required)

View Item

Downloads