Wheeler, Daniel and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (1999) Modelling the melting and solidification of solder material. In: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference. American Society of Mechanical Engineers, New York, NY, USA, pp. 397-404. ISBN 978-0791816127

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Item Type:	Conference Proceedings
Title of Proceedings:	Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference
Additional Information:	International Intersociety Electronic and Photonic Packaging Conference, Maui, Hawaii, June 13-19, 1999.
Pre-2014 Departments:	School of Computing & Mathematical Sciences
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/344

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