Parry, John, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

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Abstract

The future of many companies will depend to a large extent on their ability to initiate techniques that bring schedules, performance, tests, support, production, life-cycle-costs, reliability prediction and quality control into the earliest stages of the product creation process. Important questions for an engineer who is responsible for the quality of electronic parts such as printed circuit boards (PCBs) during design, production, assembly and after-sales support are: What is the impact of temperature? What is the impact of this temperature on the stress produced in the components? What is the electromagnetic compatibility (EMC) associated with such a design? At present, thermal, stress and EMC calculations are undertaken using different software tools that each require model build and meshing. This leads to a large investment in time, and hence cost, to undertake each of these simulations. This paper discusses the progression towards a fully integrated software environment, based on a common data model and user interface, having the capability to predict temperature, stress and EMC fields in a coupled manner. Such a modelling environment used early within the design stage of an electronic product will provide engineers with fast solutions to questions regarding thermal, stress and EMC issues. The paper concentrates on recent developments in creating such an integrated modeling environment with preliminary results from the analyses conducted. Further research into the thermal and stress related aspects of the paper is being conducted under a nationally funded project, while their application in reliability prediction will be addressed in a new European project called PROFIT.

Item Type:	Conference Proceedings
Title of Proceedings:	ITherm Proceedings
Additional Information:	[1] This paper was first presented at the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2000 (ITHERM 2000) held from 23-26 May 2000 in Las Vegas, NV, USA. [2] ISBN: 0780359127 (pbk); 0780359135 (hbk): 0780359143 (microfiche edition)
Uncontrolled Keywords:	circuit reliability, electromagnetic compatibility, life cycle costing, printed circuit design, quality control
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Publisher
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/339

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