Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit
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Wheeler, D., Lu, H. ORCID: 0000-0002-4392-6562 , Cross, M., Bailey, C. ORCID: 0000-0002-9438-3879 and McManus, K. (1999) Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit. In: The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii.
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Abstract not available
Item Type: | Conference or Conference Paper (Paper) |
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Pre-2014 Departments: | School of Computing & Mathematical Sciences |
Last Modified: | 20 Mar 2019 11:54 |
URI: | http://gala.gre.ac.uk/id/eprint/268 |
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