Wheeler, D., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Cross, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and McManus, K. (1999) Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit. In: The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii.

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Abstract

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Item Type:	Conference or Conference Paper (Paper)
Pre-2014 Departments:	School of Computing & Mathematical Sciences
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/268

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