Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Cross, Mark and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (1999) A parametric study of flip-chip reliability via computer simulation. In: Advances in electronic packaging, 1999: Proceedings of the Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference, InterPACK '99. American Society of Mechanical Engineers, New York, NY, USA, pp. 263-269. ISBN 9780791816127

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Item Type:	Conference Proceedings
Title of Proceedings:	Advances in electronic packaging, 1999: Proceedings of the Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference, InterPACK '99
Additional Information:	Presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
Pre-2014 Departments:	School of Computing & Mathematical Sciences
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/250

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