Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562, Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

PDF (Author Submitted Manuscript) 21963 NWANORO_Numerical_Simulation_of_the_Junction_Temperature_2018.pdf - Submitted Version Restricted to Registered users only Download (959kB) | Request a copy

Abstract

By increasing coolant flow rate, the junction temperature of IGBT power modules can be reduced but this is accompanied by undesirable increase in pressure and pumping power. In this paper, numerical simulation and multi-objective optimization methods have been used to obtain a trade-off relationship between reducing IGBT junction temperature and the increase in pressure drop due to increased coolant flow-rate. It is found that the pressure drop increases more than 100% for a 10% reduction in IGBT maximum junction temperature due to the increased coolant flow rate. The impact of the IGBT junction temperature on the power module lifetime has also been investigated. Moreover, an effective and efficient work-flow in integrating numerical methods software results for performing thermo-mechanical analysis under power cycling conditions has been explored.

Item Type:	Conference Proceedings
Title of Proceedings:	2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018)
Additional Information:	Presented at THERMINIC 2018 24th International Workshop on Thermal Investigations of ICs and Systems, Stockholm, Sweden, 26-28 September 2018
Uncontrolled Keywords:	Power electronics, IGBT, Numerical simulation, CFD, FEA, Reliability
Subjects:	Q Science > QA Mathematics
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG) Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) Faculty of Engineering & Science
Related URLs:	Organisation
Last Modified:	04 Mar 2022 13:06
URI:	http://gala.gre.ac.uk/id/eprint/21963

Actions (login required)

View Item

Downloads