Santhakrishnan, M., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403 and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) On the Application of Topology Optimisation Techniques to Thermal Management of Microelectronics Systems. In: IEEE EuroSimE conference, 17-20 April, 2016, Montpellier, France.

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Abstract

In this paper, an autonomous thermal management design process based on a topological optimisation algorithm is presented. The numerical framework uses a finite element multiphysics solver to assess fluid flow and heat transfer, coupled with the Method of Moving Asymptotes approach for topology optimisation. The design framework is utilised to develop a copper heatsink for a simplified electronics package at two differing Reynolds numbers. In both cases, the final shape resembles a tree like structure rather than a more conventional fin structure.

Item Type:	Conference or Conference Paper (Paper)
Uncontrolled Keywords:	Topological Optimisation
Subjects:	Q Science > QA Mathematics
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG) Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) Faculty of Engineering & Science
Last Modified:	04 Mar 2022 13:07
URI:	http://gala.gre.ac.uk/id/eprint/20185

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