Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Tourloukis, G. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 (2016) Numerical analysis of droplet deposition in inkjet printed electronics assembly. In: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-7. ISBN 978-1-5090-2106-2 (doi:10.1109/EuroSimE.2016.7463358)

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Abstract

In this paper, a computational approach for the analysis of microscale droplet impact dynamics is presented. The approach is intended to support a condition based monitoring system to enhance quality and reliability of inkjet printed electronics components. The Smoothed Particle Hydrodynamics (SPH) approach of Lucy and Gingold and Monaghan has been used as the basis for the model, with the δ-SPH terms of Marrone et al used to improve handling of the dynamic impact events and the gradient correction terms of Belytschko used to improve the accuracy of interface dynamics. Model validation has been performed through comparison against a macroscale dam break problem and through a microscale analysis designed to determine accurate surface tension-pressure behaviour based on the Young-Laplace relation. The model is used to assess impact of a single drop on a uniform surface and the three dimensional formation of multi-drop layers.

Item Type:	Conference Proceedings
Title of Proceedings:	2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Additional Information:	Conference was held from 18-20 April 2016, Montpellier, France.
Uncontrolled Keywords:	Kernel, Numerical models, Analytical models, Microelectronics, Fluids, Graphics processing units, Surface tension
Subjects:	Q Science > QA Mathematics
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) Faculty of Engineering & Science > Centre for Numerical Modelling & Process Analysis (CNMPA) > Computational Mechanics & Reliability Group (CMRG) Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) Faculty of Engineering & Science
Last Modified:	04 Mar 2022 13:07
URI:	http://gala.gre.ac.uk/id/eprint/20184

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