Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:10.1142/9900)

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Abstract

The aim of this book is to provide readers with an in-depth understanding of current state-of-the-art in the use of co-design and modeling tools to predict reliability and robustness of advanced packaging and integration technologies for both micro and power electronic systems. Authored by world leading experts in the field the of multiphysics/multi-domain modeling, the book starts with an overview of advanced packaging and integration technologies which details the manufacturing and reliability challenges that need to be addressed in the development of, for example, 3D-IC, novel bumping technologies such a copper column, lead-free solders and nano-sintering, and packaging technologies such as wafer level packaging. The book then progresses to discuss state-of-the-art modeling tools and techniques and the evolving progression towards co-design, and multi-domain analysis to ensure reliability and robustness. Finally a number of chapters demonstrate the application of these modeling methodologies and toolsets to advanced packaging and integration technologies.

Item Type:	Book
Uncontrolled Keywords:	Advanced packaging and integration technologies; modelling methodologies
Subjects:	Q Science > QA Mathematics
Faculty / School / Research Centre / Research Group:	Faculty of Engineering & Science > School of Computing & Mathematical Sciences (CMS) Faculty of Engineering & Science
Last Modified:	04 Mar 2022 13:07
URI:	http://gala.gre.ac.uk/id/eprint/18425

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