Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C. ORCID: 0000-0002-9438-3879, Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:https://doi.org/10.1109/DTIP.2008.4752943)

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Abstract

A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices. In principle, the open oven cavity can be fitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. Variable frequency microwave (VFM) heating and curing of an idealised polymer load is numerically simulated using a multi-physics approach. Electro-magnetic fields within a novel open ended microwave oven developed for use in micro-electronics manufacturing applications are solved using a dedicated Yee scheme finite-difference time-domain (FDTD) solver. Temperature distribution, degree of cure and thermal stresses are analysed using an Unstructured Finite Volume method (UFVM) multi-physics package. The polymer load was meshed for thermophysical analysis, whilst the microwave cavity - encompassing the polymer load - was meshed for microwave irradiation. The two solution domains are linked using a cross mapping routine. The principle of heating using the evanescent fringing fields within the open-end of the cavity is demonstrated. A closed loop feedback routine is established allowing the temperature within a lossy sample to be controlled. A distribution of the temperature within the lossy sample is obtained by using a thermal imaging camera.

Item Type:	Conference Proceedings
Title of Proceedings:	Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008)
Additional Information:	This paper forms part of the Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008(MEMS/MOEMS 2008), which took place 9-11 April 2008, in Nice, France. The original print version was published by EDA Publishing/DTIP, and online by IEEE Xplore, as well as arXiv.org (Cornell University Library) and I-Revues (INIST-CNRS). ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://documents.irevues.inist.fr/bitstream/handle/2042/16851/dtip08016.pdf?sequence=1
Uncontrolled Keywords:	open-ended waveguide cavity oven, curing, radio frequency (RF) curing, variable frequency microwave (VFM) heating, encapsulant, packaging
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Computer & Computational Science Research Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation
Last Modified:	13 Mar 2019 11:32
URI:	http://gala.gre.ac.uk/id/eprint/1225

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