Bailey, C. ORCID: 0000-0002-9438-3879, Stoyanov, S. ORCID: 0000-0001-6091-1226, Strusevich, N. and Yannou, J.-M. (2007) Reliability analysis of SiP structures. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283556)

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Abstract

This presentation discusses latest developments in SiP technology and the challenges for design in terms of manufacture and reliability. It presents results from a UK government funded project that aims to develop modelling techniques that will assess the thermo-mechanical reliability of SiP structures such as (i) stacked die, (ii) side-by-side dies and (iii) embedded die. Finite element analysis coupled with numerical optimisation and uncertainty analysis is used is used to model the reliability of a particular package design. In particular, the damage (energy density) in the lead free solder interconnects under accelerated temperature cycling is predicted and used to observe the fatigue life-time. Warpage of the structure is also investigated

Item Type:	Book Section
Additional Information:	This paper forms part of the published proceedings from International Symposium on High Density Packaging and Microsystems Integration Shanghai, Peoples R China, Jun 26-28, 2007 [2] This paper was also given at IMAPS POLAND 2007 31st International IMAPS Poland Conference & Exhibition, Rzeszów-Krasiczyn, 23-26 September 2007 - record 1153 in the repository
Uncontrolled Keywords:	SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation Organisation
Last Modified:	13 Mar 2019 11:32
URI:	http://gala.gre.ac.uk/id/eprint/1152

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