Strusevich, N., Bailey, C. ORCID: 0000-0002-9438-3879 and Patel, M.K. (2013) Computational modeling of electrodepostion in small features under megasonic agitation. In: 2013 European Microelectronics Packaging Conference (EMPC). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA.

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Abstract

This paper considers copper electrodeposition processes in microvias and verifies whether the quality of electroplating can be improved in the presence of acoustic streaming generated by a megasonic transducers placed into a plating cell. Our numerical experiments demonstrate that an improvement of cupric ion transport is observed in the area close to the mouth of a via, and that leads to fillings of better quality compared to those achieved under basic conditions. On the other hand, acoustic streaming inside the via has no major impact. The reasons for this lack of impact are different for blind vias and through vias.

Item Type:	Conference Proceedings
Title of Proceedings:	2013 European Microelectronics Packaging Conference (EMPC)
Additional Information:	[1] This paper was first presented at the 2013 European Microelectronics Packaging Conference (EMPC) held from 9-12 September 2013 in Grenoble, France.
Uncontrolled Keywords:	numerical modeling, high aspect ratio microvia, electroplating, megasonic agitation, acoustic streaming
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics Q Science > QD Chemistry
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Publisher Organisation
Last Modified:	13 Mar 2019 11:34
URI:	http://gala.gre.ac.uk/id/eprint/10833

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