Yin, C.Y, ORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Musallam, M., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

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Abstract

This paper describes a physics of failure (PoF) based prognostic method for power electronic modules. This method allows the reliability performance of power modules to be assessed in real time. A compact thermal model was firstly constructed to investigate the relationship between the power dissipation and the temperature in the power module. Such relationship can be used for fast calculation of junction temperatures at each interface inside power modules. The predicted temperature profile was then analyzed using a rainflow counting method so that the number of thermal cycles with different temperature ranges can be calculated. A reduced order thermo-mechanical model was also constructed to enable a fast calculation of the accumulated plastic strain in the solder material under different loading conditions. The information of plastic strains was then used in the lifetime prediction model to predict the reliability of the solder interconnect under each regular loading condition. Based on the linear damage rule and the number of cycles calculated from the rainflow counting algorithm, the accumulated damage in the power module over the whole period of usage can be predicted. As a demonstration, this method has been applied to a typical IGBT half bridge module used in aircraft applications.

Item Type:	Conference Proceedings
Title of Proceedings:	10th Electronics Packaging Technology Conference (EPTC 2008)
Additional Information:	[1] This paper was first presented at the 10th Electronics Packaging Technology Conference, (EPTC 2008) held from 9-12 December 2008 in Singapore. [2] ISBN: 9781424421176 (Print); 9781424421183 (Online).
Uncontrolled Keywords:	bridge circuits, failure analysis, insulated gate bipolar transistors, integrated circuit interconnections, integrated circuit modelling, integrated circuit reliability, modules, plastic deformation, power bipolar transistors, power integrated circuits, semiconductor device, reliability, soldering, physics of failure (PoF)
Subjects:	Q Science > QA Mathematics > QA76 Computer software Q Science > QC Physics T Technology > TL Motor vehicles. Aeronautics. Astronautics
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:	Publisher Publisher Organisation
Last Modified:	20 Mar 2019 11:54
URI:	http://gala.gre.ac.uk/id/eprint/10760

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