Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Rizvi, M.J., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

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Abstract

This paper presents modeling results about the performance of flexible substrates when subjected to higher lead-free reflow temperatures. Both adhesiveless and adhesive types of polyimide substrates were studied. Finite element (FE) models of flex substrates were built, two copper tracks located in the centre of the substrate was considered. The thermal induced shear stress in the flex substrate during the lead-free reflow process was studied and the effect of the design changes including the track thickness, flex thickness, and copper width were studied. For both types of flexes, the one of most important variables for minimizing damage to the substrate is the height of the copper tracks. The height of flex and the width of copper track show less impact. Beside of the geometry effects, the increase in reflow peak temperature can also result in a significant increase in the interfacial stress between the copper track and flex. Higher stresses were identified within the adhesive flex due to the big CTE mismatch between the copper and adhesive/dielectric

Item Type:	Book Section
Additional Information:	Paper originally presented at 1st Electronics Systemintegration Technology Conference, Dresden, Germany, 5-7 September 2006
Uncontrolled Keywords:	flexible substrates, thermo-mechanical, lead free solder
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics
Pre-2014 Departments:	School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Science School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:	Publisher Organisation Organisation Organisation Organisation Organisation
Last Modified:	30 Sep 2019 14:16
URI:	http://gala.gre.ac.uk/id/eprint/1049

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