Polymer curing within an optimised open-ended microwave oven
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris and Parrott, Kevin (2009) Polymer curing within an optimised open-ended microwave oven. In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20. ISBN 978-2-87487-006-4 (doi:10.1109/EUMC.2008.4751375)Full text not available from this repository.
An open-ended microwave oven in the form of an open waveguide cavity partially filled with a low loss dielectric material is proposed for the curing of polymer materials during flip-chip assembly. The open-ended nature of the design allows for simultaneous precision alignment and curing of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). A well defined resonance can be achieved within the dielectric filling with evanescent fields in the open end of the cavity. A new optimisation scheme, based on a quarter wave impedance controlling section, is presented for the maximisation of the evanescent (heating) fields. In order to optimise the fields (and therefore the heating capability) a thin layer of low-loss dielectric material is inserted at the interface. Adjustment of the thickness and permittivity of the dielectric insert allows the phase of the reflection coefficient at the dielectric-air interface to be controlled. Experimental results show that a tenfold improvement in heating times can be achieved within a lossy polymer sample.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,|
|Additional Information:|| This paper was presented at the 38th European Microwave Conference 2008, (EuMC 2008, 38th) held from 27-31 October 2008 in Amsterdam, The Netherlands.  This work was supported by the Innovative Electronics Manufacturing Centre (IeMRC) UK, co-ordinated by Loughborough University through the project FAMOBS (FE/05/01/07). This work was also made possible through the funding of the Grand Challenge project through 3D-MINTEGRATION (EP/C534212/1) sponsored by the Engineering and Physical Sciences Research Council (EPSRC).  INSPEC Accession Number: 10400131|
|Uncontrolled Keywords:||assembly, curing, dielectric losses, dielectric materials, electromagnetic heating, microwave devices, microwave ovens, packaging, polymers, waveguide components|
|Subjects:||T Technology > TJ Mechanical engineering and machinery
T Technology > TX Home economics
|School / Department / Research Groups:||School of Computing & Mathematical Sciences
Faculty of Architecture, Computing & Humanities > School of Computing & Mathematical Sciences
|Last Modified:||26 May 2016 10:23|
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