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Multiphysics modelling of solder joint formation

Multiphysics modelling of solder joint formation

Bailey, Christopher, Wheeler, Daniel and Cross, Mark (1997) Multiphysics modelling of solder joint formation. In: ASME, EEP - Advances in Electronic Packaging, 15 -19 June 1997, Kohala coast, Hawaii.

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Abstract

Abstract not available

Item Type: Conference or Conference Paper (Paper)
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 14 Oct 2016 09:00
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/347

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