Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1997) Multiphysics modelling of solder joint formation. In: ASME, EEP - Advances in Electronic Packaging, 15 -19 June 1997, Kohala coast, Hawaii.

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Item Type:	Conference or Conference Paper (Paper)
Pre-2014 Departments:	School of Computing & Mathematical Sciences
Last Modified:	13 Mar 2019 11:30
URI:	http://gala.gre.ac.uk/id/eprint/347

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