A

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:10.1016/j.matdes.2011.02.045)

D

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.01.028)

M

Mejasson, Patrick, Petridis, Miltos, Knight, Brian, Soper, Alan ORCID: https://orcid.org/0000-0002-0901-9803 and Norman, Phil (2001) Intelligent design assistant (IDA): a case base reasoning system for material and design. Materials and Design, 22 (3). pp. 163-170. ISSN 0261-3069 (doi:10.1016/S0261-3069(00)00066-2)

T

Tzanakis, I., Lebon, G.S.B., Eskin, D.G. and Pericleous, K. ORCID: https://orcid.org/0000-0002-7426-9999 (2015) Investigation of the factors influencing cavitation intensity during the ultrasonic treatment of molten aluminium. Materials and Design, 90. 979 - 983. ISSN 0261-3069 (doi:10.1016/j.matdes.2015.11.010)