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electronics assembly applications solder pastes wall-slip effects

Number of items: 3.

electronics assembly applications

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.05.028)

solder pastes

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.05.028)

wall-slip effects

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.05.028)

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