Browse by Journal Title

[up]

Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping

Jump to: M

Number of items: 1.

M

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.05.028)

This list was generated on Sat Dec 21 15:53:24 2024 UTC.