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digital simulation electronic engineering computing heat transfer melting multiphysics modeling printed circuit manufacture solder soldering solidification surface tension thermal stress
Number of items: 11.

digital simulation

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

electronic engineering computing

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

heat transfer

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

melting

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

multiphysics modeling

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

printed circuit manufacture

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

solder

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

soldering

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

solidification

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

surface tension

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

thermal stress

Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:10.1109/6144.814964)

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