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Bailey, Christopher 
ORCID: https://orcid.org/0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:10.1109/6144.814964)