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Bailey, Christopher
ORCID: 0000-0002-9438-3879
, Wheeler, Daniel and Cross, Mark
(1999)
An integrated modeling approach to solder joint formation.
IEEE Transactions on Components and Packaging Technology, 22 (4).
pp. 497-502.
ISSN 1521-3331
(doi:https://doi.org/10.1109/6144.814964)