electronic control unit

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)

finite element analysis

Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2013.12.006)

lifecycle assesment

Walsh, Conor ORCID: https://orcid.org/0000-0003-4829-2754 and Thornley, Patricia (2012) A comparison of two low grade heat recovery options. Applied Thermal Engineering, 53 (2). pp. 210-216. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2012.04.035)

low grade heat

Walsh, Conor ORCID: https://orcid.org/0000-0003-4829-2754 and Thornley, Patricia (2012) A comparison of two low grade heat recovery options. Applied Thermal Engineering, 53 (2). pp. 210-216. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2012.04.035)

metal matrix composites

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)

Microelectronics

Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

representative volume element

Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2013.12.006)

solder die-attach

Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2013.12.006)

Solder thermal interface materials

Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

solder voids

Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2013.12.006)

thermal conductive polymer

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)

thermal interface material

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)

thermal management

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2010.09.023)

Thermal resistance

Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

thermo-mechanical reliability

Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:10.1016/j.applthermaleng.2013.12.006)

Three-dimensional

Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Virtual testing

Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)

Void morphology

Okereke, Michael I. ORCID: https://orcid.org/0000-0002-2104-012X and Ling, Yuxiao (2018) A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials. Applied Thermal Engineering, 142. pp. 346-360. ISSN 1359-4311 (Print), 1873-5606 (Online) (doi:10.1016/j.applthermaleng.2018.07.002)