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Items where Author is "Yin, C."

Items where Author is "Yin, C."

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backlight units backlights design environment electro-migration finite element analysis human vision models junction temperatures just-noticeable difference key parameters LCD LED LED backlighting devices light emitting diodes (LEDs) luminance metal migration multi-disciplinary analysis multi-disciplinary design multi-physics optical and thermal modelling techniques optical performance optical simulation Power Electronic Module (PEM) predictive reliability ray tracing calculations risk assessment ruggedized electronic display solid state lighting solid state lighting systems thermal management thermo-mechanical loading viewability
Number of items: 32.

backlight units

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

backlights

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

design environment

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

electro-migration

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

finite element analysis

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

human vision models

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

junction temperatures

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

just-noticeable difference

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

key parameters

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

LCD

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

LED

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

LED backlighting devices

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

light emitting diodes (LEDs)

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

luminance

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

metal migration

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

multi-disciplinary analysis

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

multi-disciplinary design

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

multi-physics

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Tilford, T. ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Rizvi, J. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

optical and thermal modelling techniques

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

optical performance

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

optical simulation

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

Power Electronic Module (PEM)

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

predictive reliability

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

ray tracing calculations

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

risk assessment

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

ruggedized electronic display

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

solid state lighting

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

solid state lighting systems

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

thermal management

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lee, Y., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Strusevich, N. and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

thermo-mechanical loading

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Zhu, X., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

viewability

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Yin, C. ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

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