Bailey, C. ORCID: 0000-0002-9438-3879 , Zhu, X., Lu, H. ORCID: 0000-0002-4392-6562 and Yin, C. ORCID: 0000-0003-0298-0420 (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:https://doi.org/10.1109/EPTC.2012.6507130)

Bailey, C. ORCID: 0000-0002-9438-3879 , Yin, C. ORCID: 0000-0003-0298-0420 , Lu, H. ORCID: 0000-0002-4392-6562 and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:https://doi.org/10.1109/ESIME.2011.5765859)

Bailey, C. ORCID: 0000-0002-9438-3879 , Lee, Y., Lu, H. ORCID: 0000-0002-4392-6562 , Strusevich, N. and Yin, C. ORCID: 0000-0003-0298-0420 (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:https://doi.org/10.1109/ISAPM.2010.5441377)

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Tilford, T. ORCID: 0000-0001-8307-6403 , Rizvi, J. and Yin, C. ORCID: 0000-0003-0298-0420 (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:https://doi.org/10.1109/ESIME.2009.4938505)

Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Yin, C. ORCID: 0000-0003-0298-0420 and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896