Skip navigation

Items where Author is "Xian, Jingwei"

Items where Author is "Xian, Jingwei"

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
crystal plasticity failure finite element analysis microstructure multi-scale modelling SAC305 solder joints thermal fatigue thermo-mechanical Reliability
Number of items: 15.

crystal plasticity

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

failure

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

finite element analysis

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

microstructure

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

multi-scale modelling

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

SAC305

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

solder joints

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

thermal fatigue

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:10.1038/s41467-024-48532-6)

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

thermo-mechanical Reliability

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:10.1016/j.ijplas.2022.103308)

This list was generated on Sun Dec 22 13:07:35 2024 UTC.