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Items where Author is "Wu, B.Y."

Items where Author is "Wu, B.Y."

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63Sn37Pb solder joints and alloys and failure Au/Ni metallization ball grid array (BGA) ball shear test BGA bond strength brittleness contact angle corrosion fatigue cracking Cu trace current crowding current stressing electromigration electron bombardment embrittlement failure mechanisms fatigue Finite Element Analysis(FEA) finite element modeling flux fracture fracture propogation path heat dissipation high current density induced damage interfacial reaction interfacial reaction phenomena intermetallic compound (IMC) intermetallic compounds Joule heating mathematical modelling metals off-chip interconnection on-chip interconnection semimetals Sn-2.8Ag-0.5Cu-1.0Bi solder interface strength solder joint solder joints surface tension thermomigration Wettability wetting force
Number of items: 50.

63Sn37Pb solder joints

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

and alloys

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

and failure

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Au/Ni metallization

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

ball grid array (BGA)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

ball shear test

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

BGA

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

bond strength

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

brittleness

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

contact angle

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

corrosion fatigue

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

cracking

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Cu trace

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

current crowding

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

current stressing

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

electromigration

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

electron bombardment

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

embrittlement

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

failure mechanisms

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

fatigue

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Finite Element Analysis(FEA)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

finite element modeling

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

flux

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

fracture

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

fracture propogation path

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

heat dissipation

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

high current density induced damage

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

interfacial reaction

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-007-1836-y)

interfacial reaction phenomena

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compound (IMC)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

Joule heating

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

mathematical modelling

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

metals

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

off-chip interconnection

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

on-chip interconnection

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

semimetals

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:https://doi.org/10.1063/1.2747183)

Sn-2.8Ag-0.5Cu-1.0Bi

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

solder interface strength

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

solder joint

Alam, M.O., Wu, B.Y., Chan, Y.C. and Tu, K.N. (2005) High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints. Acta Materialia, 54 (3). pp. 613-621. ISSN 1359-6454 (doi:https://doi.org/10.1016/j.actamat.2005.09.031)

solder joints

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

surface

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

tension

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

thermomigration

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

Wettability

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

wetting force

Rizvi, M.J., Chan, Y.C., Bailey, C. ORCID: 0000-0002-9438-3879 , Lu, H. ORCID: 0000-0002-4392-6562 , Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-005-0239-6)

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