Hua, Lu, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:10.1109/ICEPT.2018.8480746)

Ruperao, Pradeep, Chan, Chon-Kit Kenneth, Azam, Sarwar, Karafiátová, Miroslava, Hayashi, Satomi, Čížková, Jana, Saxena, Rachit K., Šimková, Hana, Song, Chi, Vrána, Jan, Chitikineni, Annapurna, Visendi, Paul, Gaur, Pooran M., Millán, Teresa, Singh, Karam B., Taran, Bunyamin, Wang, Jun, Batley, Jacqueline, Doležel, Jaroslav, Varshney, Rajeev K. and Edwards, David (2014) A chromosomal genomics approach to assess and validate the desi and kabuli draft chickpea genome assemblies. Plant Biotechnology Journal, 12 (6). pp. 778-786. ISSN 1467-7644 (Print), 1467-7652 (Online) (doi:10.1111/pbi.12182)