Items where Author is "Tang, Ying Kit"
computational models
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:10.1109/ISSE.2009.5206925)
computer modelling
Tang, Ying Kit (2012) A risk analysis methodology for micro/nano manufacturing. PhD thesis, University of Greenwich.
design methodology
Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)
Design of Experiment (DoE) method
Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)
design process
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)
failure
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)
focused ion beam
Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)
Focused Ion Beam (FIB) method
Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)
manufacturing process
Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)
micro manufacturing
Tang, Ying Kit (2012) A risk analysis methodology for micro/nano manufacturing. PhD thesis, University of Greenwich.
micro-machining process
Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)
micro-probe
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)
microsystems
Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
multi-physics
Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
nano manufacturing
Tang, Ying Kit (2012) A risk analysis methodology for micro/nano manufacturing. PhD thesis, University of Greenwich.
novel micro-integrated products
Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)
optimisation
Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
product design
Tang, Ying Kit (2012) A risk analysis methodology for micro/nano manufacturing. PhD thesis, University of Greenwich.
prototypes
Tang, Ying Kit (2012) A risk analysis methodology for micro/nano manufacturing. PhD thesis, University of Greenwich.
reduced order models
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)
Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
Reduced Order Models (ROM)
Tang, Ying Kit, Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Y.C. (2008) Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 941-946. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Electronic) (doi:10.1109/ESTC.2008.4684478)
reliability
Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9
risk mitigation
Narania, Sailesh, Eshahawi, Tarek, Gindy, Nabil, Tang, Ying Kit, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Ridout, Stephen and Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 (2008) Risk mitigation framework for a robust design process. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1075-1080. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684501)
three-dimensional miniaturised products
Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Rajaguru, Pushpa ORCID: https://orcid.org/0000-0002-6041-0517, Tang, Ying Kit, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:10.1109/ISSE.2010.5547362)
uncertainty analysis
Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9