Article

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.287)

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2011.02.104)

Takyi, G., Amalu, E.H. and Bernasko, P.K. (2011) Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module. Soldering and Surface Mount Technology, 23 (2). pp. 115-119. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120186)

Takyi, G. and Ekere, N.N. (2010) Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs. Soldering and Surface Mount Technology, 22 (3). pp. 17-21. ISSN 0954 0911 (doi:https://doi.org/10.1108/09540911011054154)

Takyi, G. and Ekere, N.N. (2010) Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering. Soldering & Surface Mount Technology, 22 (2). pp. 37-42. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911011036271)

Conference Proceedings

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:https://doi.org/10.1063/1.3552519)

Conference or Conference Paper

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.