Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.287)

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2011.02.104)

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:https://doi.org/10.1063/1.3552519)

Takyi, G., Amalu, E.H. and Bernasko, P.K. (2011) Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module. Soldering and Surface Mount Technology, 23 (2). pp. 115-119. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120186)

Takyi, G. and Ekere, N.N. (2010) Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma-treated HASL finish PCBs. Soldering and Surface Mount Technology, 22 (3). pp. 17-21. ISSN 0954 0911 (doi:https://doi.org/10.1108/09540911011054154)

Takyi, G. and Ekere, N.N. (2010) Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering. Soldering & Surface Mount Technology, 22 (2). pp. 37-42. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911011036271)