Skip navigation

Items where Author is "Subbarayan, G."

Items where Author is "Subbarayan, G."

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
adhesives CFD circuit reliability computational fluid dynamics conducting polymers conductive adhesive creep design for manufacture ductility electromagnetic compatibility electronic design automation fatigue filled polymers finite difference time-domain analysis flip-chip devices heat conduction laser laser beam welding Maxwell equations mesh generation microwave cure microwave heating modelling modelling polymerisation semiconductor device packaging semiconductor lasers semiconductor process modelling soldering stress analysis surface mount technology temperature distribution thermal thermal expansion thermal management (packaging) thermal stresses
Number of items: 37.

adhesives

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

CFD

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

circuit reliability

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

computational fluid dynamics

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

conducting polymers

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

conductive adhesive

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

creep

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

design for manufacture

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

ductility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

electromagnetic compatibility

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

electronic design automation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

fatigue

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

filled polymers

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

finite difference time-domain analysis

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

flip-chip devices

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

heat conduction

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

laser

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

laser beam welding

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

Maxwell equations

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

mesh generation

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

microwave cure

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

microwave heating

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

modelling

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

modelling polymerisation

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

semiconductor device packaging

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

semiconductor lasers

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

semiconductor process modelling

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

soldering

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

stress analysis

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

surface mount technology

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

temperature distribution

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

thermal

Gwyer, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012447)

thermal expansion

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

thermal management (packaging)

Glinski, G.P. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2002) Microwave cure of conductive adhesives for flip-chip & microsystems applications. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012543)

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

thermal stresses

Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2002) An integrated approach to flow, thermal and mechanical modeling of electronics devices. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868. ISBN 0780371526 ISSN 1089-9870 (doi:10.1109/ITHERM.2002.1012545)

This list was generated on Sun Dec 22 13:09:52 2024 UTC.