Items where Author is "Subbarayan, G."
Conference Proceedings
Glinski, G.P. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2002)
Microwave cure of conductive adhesives for flip-chip & microsystems applications.
In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings].
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 848-853.
ISBN 0780371526
ISSN 1089-9870
(doi:10.1109/ITHERM.2002.1012543)
Gwyer, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Pericleous, K.
ORCID: https://orcid.org/0000-0002-7426-9999, Philpott, D. and Misselbrook, P.
(2002)
Mathematical modelling: a laser soldering process for an optoelectronics butterfly package.
In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings].
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127.
ISBN 0780371526
ISSN 1089-9870
(doi:10.1109/ITHERM.2002.1012447)
Parry, John, Marooney, Chris, Warner, Matt, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis
ORCID: https://orcid.org/0000-0002-7426-9999
(2002)
An integrated approach to flow, thermal and mechanical modeling of electronics devices.
In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings].
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, U.S.A., pp. 862-868.
ISBN 0780371526
ISSN 1089-9870
(doi:10.1109/ITHERM.2002.1012545)
Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Norman, P. and Gebreamlak, S.
(1997)
Computational modelling of defects in fibre optic cables.
In: Proceedings of the pacific RIM/ASME international intersociety electronic & photonic packaging conference Interpack '97.
The American Society of Mechanical Engineers, New York, NY, US, pp. 621-627.
ISBN 0 7918 1559 5