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Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.01.028)

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Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416511)

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Marks, A.E., Mallik, S., Ekere, N.N. and Seman, A. (2008) Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 829-832. ISBN 97814244-28137 (Print), 978-1-4244-2814-4 (Electronic) (doi:https://doi.org/10.1109/ESTC.2008.4684459)

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