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Items where Author is "Roulston, John"

Items where Author is "Roulston, John"

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analytical models computed tomography conductivity failure analysis heating hot solder lead materials microelectronics reliability solders thermal analysis thermal management (packaging) thermal modelling tin alloys whiskers (crystal)
Number of items: 16.

analytical models

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

computed tomography

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

conductivity

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

failure analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

heating

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

hot solder

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

lead

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

materials

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

microelectronics

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

solders

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

thermal analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

thermal management (packaging)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

thermal modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

tin alloys

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

whiskers (crystal)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Roulston, John, Stewart, Paul and Tollafield, Peter (2014) Study of impact of thermal refinishing process on reliability of COTS components. In: 20th International Workshop on Thermal Investigations of ICs and Systems. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781479954155 (doi:https://doi.org/10.1109/THERMINIC.2014.6972531)

This list was generated on Fri Nov 22 03:16:30 2024 UTC.