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Items where Author is "Ramakrishna, Koneru"

Items where Author is "Ramakrishna, Koneru"

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Group by: Item Type | Uncontrolled Keywords | No Grouping
ceramic packaging CFD chip-on-board packaging circuit reliability Coffin-Manson computational fluid dynamics cooling electronics packaging creep curing electromagnetic compatibility fatigue flip-chip flip-chip devices flipchip fluctuations integrated optoelectronics life cycle costing modeling modelling modules optical backplanes optical waveguides photodiodes plastic deformation printed circuit design quality control reflow reliability resistors shear turbulence solders stress analysis surface emitting lasers surface mount technology thermal expansion underfill viscoplasticity
Number of items: 37.

ceramic packaging

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

CFD

Dhinsa, Kulvir K., Bailey, Chris J. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

chip-on-board packaging

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

circuit reliability

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

Coffin-Manson

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

computational fluid dynamics

Dhinsa, Kulvir K., Bailey, Chris J. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

cooling electronics packaging

Dhinsa, Kulvir K., Bailey, Chris J. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

creep

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

curing

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

electromagnetic compatibility

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

fatigue

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

flip-chip

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

flip-chip devices

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

flipchip

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

fluctuations

Dhinsa, Kulvir K., Bailey, Chris J. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

integrated optoelectronics

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

life cycle costing

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

modeling

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

modelling

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

modules

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

optical backplanes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

optical waveguides photodiodes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

plastic deformation

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

printed circuit design

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

quality control

Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris (2000) Multiphysics modelling for electronics design. In: ITherm Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866175)

reflow

Wheeler, D. and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Modelling technology to predict flip-chip assembly. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866174)

reliability

Dhinsa, Kulvir K., Bailey, Chris J. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

resistors

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

shear turbulence

Dhinsa, Kulvir K., Bailey, Chris J. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A. ORCID logoORCID: https://orcid.org/0000-0002-7426-9999 (2004) Turbulence modelling and its impact on CFD predictions for cooling of electronic components. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1319214)

solders

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

stress analysis

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

surface emitting lasers

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

surface mount technology

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

underfill

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

viscoplasticity

Warner, Matt, Parry, John, Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2004) Solder life prediction in a thermal analysis software environment. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318309)

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