Items where Author is "Ramakrishna, Koneru"
Conference Proceedings
Warner, Matt, Parry, John, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562
(2004)
Solder life prediction in a thermal analysis software environment.
In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings].
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-396.
ISBN 0780383575
ISSN 1089-9870
(doi:10.1109/ITHERM.2004.1318309)
Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K.
(2004)
Thermal, mechanical and optical modelling of VCSEL packaging.
In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings].
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410.
ISBN 0780383575
ISSN 1089-9870
(doi:10.1109/ITHERM.2004.1318311)
Dhinsa, Kulvir K., Bailey, Chris J. ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis A.
ORCID: https://orcid.org/0000-0002-7426-9999
(2004)
Turbulence modelling and its impact on CFD predictions for cooling of electronic components.
In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings].
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 487-494.
ISBN 0780383575
ISSN 1089-9870
(doi:10.1109/ITHERM.2004.1319214)
Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562 and Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879
(2000)
Material properties, geometry and their effect on the fatigue life of two flip-chip models.
In: ITHERM Proceedings.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71.
ISBN 0780359127
ISSN 0189-9870
(doi:10.1109/ITHERM.2000.866172)
Wheeler, D. and Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879
(2000)
Modelling technology to predict flip-chip assembly.
In: ITHERM Proceedings.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 79-85.
ISBN 0780359127
ISSN 0189-9870
(doi:10.1109/ITHERM.2000.866174)
Parry, John, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Addison, Chris
(2000)
Multiphysics modelling for electronics design.
In: ITherm Proceedings.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 86-93.
ISBN 0780359127
ISSN 0189-9870
(doi:10.1109/ITHERM.2000.866175)